Chemical Vapor Deposition (CVD)

Chemical Vapor Deposition (CVD) is a widely used method for material deposition. It is the fundamental part for many industries such as Semiconductor, MEMS, Solar, and Nanotechnology.

During the chemical vapor deposition process, the precursor is introduced into a process chamber through vapor source and reacted at a certain temperature and pressure. The desired thin film or nanostructure materials are deposited onto a substrate inside the process chamber. The thickness and composition of the deposited materials can be controlled by the vapor concentration, temperature, and pressure.

CVD Equipment offers process systems for R&D and production through our division as well as out First Nano division. We offer Atmospheric Pressure CVD (APCVD), Low Pressure CVD (LPCVD), Ultra High Vacuum CVD (UHVCVD), Plasma Enhanced CVD (PECVD) and Metalorganic CVD (MOCVD). We also offer customized CVD systems such as multi chamber cluster systems and Reel to Reel systems.

Please contact us for further details.