Atmospheric Pressure Chemical Vapor Deposition (APCVD)

Atmospheric Pressure Chemical Vapor Deposition (APCVD) deposits a layer of material several microns thick onto a wafer or substrate.   APCVD operates at atmospheric pressure to slightly reduced atmospheric pressure and is used to grow epitaxial films of Si, compound semiconductors, SiO₂, antireflection (AR) coatings and transparent conductive oxide (TCO) coatings.  APCVD systems are also used as a surface finishing process for such items as tools and turbine blade production to improve lifetime performance.

Since a vacuum system is not required, APCVD systems have a relatively low operating cost. Variations in temperature, pressure, and gas flow dynamics affect the properties of the deposited film and are used as process control variables. 

CVD Equipment offers APCVD systems from lab scale research systems (EasyTube™) to large volume continuous production systems (CVDgCoat™).  APCVD is a simple process with a high deposition rate utilizing relatively low temperatures.  The application can be easily scaled-up from research scale to production volumes. We are currently developing online and offline APCVD CVDgCoat™ systems to meet the high volume, low cost demand in solar industry.